0000004178 00000 n 0000000016 00000 n QCC3056 is designed specifically to help manufacturers to differentiate at a range of tiers by bringing our quad-core architecture and supporting our premium audio technologies in the very fast-moving, price-sensitive truly wireless earbud category. Innovative Qualcomm TrueWireless™ Mirroring technology is designed to deliver a superior user experience by improving robustness and supporting dynamic and seamless bud-to-bud role-swapping with Bluetooth address handover even during run time. The GAVDP defines two roles, that of an Initiator and an Acceptor: Initiator (INT) – This is the device that initiates a signaling procedure. %PDF-1.4 %���� The IoT Series SoC series support audio codec, dual-band Wi-Fi/ Bluetooth combo with good co-existence capability, LCD panel, patented ultra-low audio latency feature, and the world's smallest single chip Wi-Fi IP cam with 1080p HD video encoder. H�\��n�@���C����XB�g#��?Zg �؋����o�SJV�S���C7�n����ɥ?ƾ>�ɝڮõ��up�pn�$�]���2�����4��)\�ݩO�ҥ?���4��ö��1I��M���~��.=܆�O��nr+�ٸ&��B_��[u .�Þ�M|�N������}.��a� ס��Xu琔�xl\��M����v篟s�k���yo����N��y�������Ԉ���#�G���qHʂ�X�Ȩ3�:�.�h�hO���l�Q4� Add Bluetooth ® into smart home, industrial, consumer electronics, beacons, fitness and medical applications with our Bluetooth SoCs, certified Bluetooth modules and software. 0000000995 00000 n Bluetooth 5.2 Dual Mode Audio SoC : Low cost earbuds; Bluetooth SW stack. • ROM-based devices: Enumerating and power-managing other devices (such as an FM transmitter or GPS device) that share the same bus as the Bluetooth radio. This SoC is designed to help early-adopting manufacturers develop truly wireless earbuds that deliver the audio sharing use cases supported by the exciting LE Audio standard. 0000036396 00000 n Realtek launches a full range of IoT single-chip solutions including IoT control, voice, and video applications. Comprehensive ADK software support for easy application development With the launch of the QCC305x SoC series, Qualcomm is attempting to bring many of the premium audio features from high-end TWS earbuds to the mid-tier and more affordable levels. The QCC3026 is designed to provide our customers with a solution that helps to reduce development time and is cost-effective. 0000009208 00000 n 0000007199 00000 n 0000006172 00000 n QCC3056 is designed specifically to help manufacturers to differentiate at a range of tiers by bringing our quad-core architecture and supporting our premium audio technologies in the very fast-moving, price-sensitive truly wireless earbu.... Qualcomm® QCC3056 is an ultra-low power, single-chip solution, optimized for use in truly wireless earbuds and hearables. ?���o��vt�ٸ:���ײ�V^�˧e/�:�7��%������GWL�%a�������P�����q�}�m������p��\�)�l�|O���Ymһ/���}��.�Xj�Vj�~�~�^QO�ߨߠw�;h�MMҬ����� ~�Yˣ�_R/���S{h��@�����ڠ���������[h�{�B��A� d0B��A� d0º2�en�܄� rf%�*0���98989898989898�� xref 0000017354 00000 n Generic Audio/Video Distribution Profile (GAVDP) GAVDP provides the basis for A2DP and VDP, the basis of the systems designed for distributing video and audio streams using Bluetooth technology. endstream endobj 360 0 obj <>/Metadata 32 0 R/Pages 31 0 R/StructTreeRoot 34 0 R/Type/Catalog/ViewerPreferences<>>> endobj 361 0 obj <>/ExtGState<>/Font<>/ProcSet[/PDF/Text/ImageC]/XObject<>>>/Rotate 0/StructParents 0/Thumb 29 0 R/TrimBox[0.0 0.0 612.0 792.0]/Type/Page>> endobj 362 0 obj <> endobj 363 0 obj <> endobj 364 0 obj <> endobj 365 0 obj [/Separation/blue#20RGB/DeviceRGB<>] endobj 366 0 obj <> endobj 367 0 obj <> endobj 368 0 obj <> endobj 369 0 obj <> endobj 370 0 obj <>stream Extremely low-power Bluetooth Audio SoC in a WLCSP package, designed for premium audio feature differentiation in truly wireless earbuds at a range of tiers. In essence, the Bluetooth LE Audio standard promises to deliver better sound quality while also using less power. Designed to support forthcoming Bluetooth LE Audio standard, Powerful quad-core processor architecture – designed to support complex use cases, Qualcomm TrueWireless™ Mirroring technology for improved robustness and a superior user experience, Designed to support wake word and button activated digital assistants including Amazon Alexa Voice Service and Google Assistant, Software architecture compatible with Qualcomm® QCC302x and QCC304x series, Embedded ROM + RAM and external Q-SPI Flash, Connectivity to external SRAM or 2nd Flash Device, High-performance audio combined with low-power consumption, Support for Qualcomm® Active Noise Cancellation (ANC) – feedforward, feedback and hybrid – and Qualcomm® Adaptive Active Noise Cancellation, Bluetooth Version: Bluetooth 5.2 Qualified, Bluetooth Technology: BR, EDR, Bluetooth Low Energy, Dual-mode Bluetooth, DSP Technology: 2x Qualcomm® Kalimba™ DSP, Digital Assistant Activation: Button press, Always on voice wake-word support, Audio Technology: Qualcomm TrueWireless™ Mirroring technology, Qualcomm® Adaptive Active Noise Cancellation, Qualcomm® cVc™ Echo Cancellation and Noise Suppression, Qualcomm® Active Noise Cancellation, Qualcomm® aptX™ audio technology, Qualcomm® aptX™ audio playback support: Qualcomm® aptX™ Voice, Qualcomm® aptX™ Adaptive, Voice Services Support: Amazon Alexa Voice Service, Google Assistant (and others), Qualcomm® Active Noise Cancelling (ANC) technology: Feedback, Adaptive, Feedforward, Hybrid, Qualcomm® cVc™ Echo Cancellation and Noise Suppression (ECNS) technology: 2-mic Headset, 1-mic Headset, Audio outputs: 1-ch 99dBA Class-D headset, Supported Interfaces: 24-bit audio interfaces. 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